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experimental-setup- Pressure Sensitive film between top and bottom mold

Flip Chip on PCB

flow front after filling of glob top space

lamination wrinkles

MAP moulding on FR-4 board

Mold tool and PCB substrate with film gate

Nip roller pressure in PCB lamination press

nip roller pressure profile in lamination press

nip rolls uniform pressure

nip-roller bending

open circuit defects

post-lamination-wrinkles

Pressure distribution during MAP moulding

pressure drops with increasing distance to the film gate

pressure graph - recorded by Kistler pressure sensor

Properly aligned laminator

rolls low pressure

single flip chip on PCB encapsulation process